• Alumina High-Temperature Substrate,Alumina High-Temp Substrate,
Alumina Ceramic High-Temp Substrate,
High-Temperature Alumina Substrate
  • Alumina High-Temperature Substrate,Alumina High-Temp Substrate,
Alumina Ceramic High-Temp Substrate,
High-Temperature Alumina Substrate

Alumina High-Temperature Substrate

No.AlO

Product Name:
Alumina High-Temperature Substrate / Insulation Sheet

Product Material:
High-Purity Alumina Ceramic (Al₂O₃ 99.5%-99.9%). For specific thermal shock resistance scenarios, fused quartz or Zirconia Toughened Alumina (ZTA) composites are optional.

Material Characteristics:
Exceptional high-temperature stability and structural strength (long-term service temperature >1600°C), Excellent electrical insulation (high volume resistivity at elevated temperatures), Good thermal shock resistance (dependent on purity and microstructure), Low coefficient of thermal expansion (~7.5×10⁻⁶/°C), High hardness and superior wear resistance, Outstanding chemical inertness (resistant to molten metals, acids/alkalis, and oxidizing/reducing atmospheres), Low thermal conductivity (effective as thermal insulation), Low vapor pressure and vacuum compatibility.

Application Fields:
Wafer carriers (boats), heat baffles inside semiconductor diffusion furnaces, annealing furnaces, and epitaxial reaction chambers; Furnace liners, setter plates, and rails for high-temperature furnaces (e.g., muffle furnaces, sintering furnaces); Insulating separators and sealing gaskets for fuel cells and electrolyzers; Protective sleeves and insulating bases for high-temperature sensors; Substrates for thermal barrier coatings or test components in aerospace engines; Viewport windows and internal thermal insulation liners for high-temperature reactors in petrochemical industries.

Application Industries:
Semiconductor manufacturing and equipment, Aerospace, New Energy (hydrogen, advanced batteries), Petrochemical, Advanced Mechanical Equipment (high-temperature industrial furnaces, heat treatment equipment), Electronic Engineering (high-temperature electronic packaging).

Processing Difficulties:
Controlling sintering deformation and warpage during manufacturing of large-sized, thin flat plates; Ensuring reliability against thermal shock under repeated rapid heating and cooling cycles; Achieving high dimensional stability and low creep at high temperatures; Meeting extremely high surface flatness and cleanliness requirements for components like wafer carriers; Avoiding the initiation and propagation of micro-cracks when processing thin sheets; Guaranteeing long-term chemical stability under extreme temperatures and atmospheres.

Processing Flow:
Selection and formulation of high-purity alumina powder → Tape casting, dry pressing, or isostatic pressing → Precision green machining (e.g., hole drilling, slotting) → High-temperature sintering (air atmosphere, temperature >1700°C) → Surface grinding and double-side polishing to ensure flatness and parallelism → CNC precision contour cutting and drilling → Edge chamfering and refinement → Ultrasonic cleaning and high-temperature firing for impurity removal → Rigorous inspection (dimensional tolerance, flatness, parallelism, surface roughness, simulated high-temperature performance testing) → Clean packaging

Delivery Period:
Standard thickness and size sheets: 30-50 days
Large size / ultra-thin / ultra-high flatness / custom parts with complex holes/slots: 60-100 days

  • Alumina High-Temperature Substrate,Alumina High-Temp Substrate,
Alumina Ceramic High-Temp Substrate,
High-Temperature Alumina Substrate

Description

Alumina High-Temperature Sheets are critical ceramic functional components designed for extreme high-temperature and harsh environments. While providing excellent high-temperature structural support, they often combine efficient electrical insulation and thermal management functions. Leveraging the inherent outstanding high-temperature stability, chemical inertness, and balanced physical properties of alumina, these ceramic sheets can operate reliably over the long term at temperatures where metals and most polymers fail. They serve as indispensable interface materials bridging high-temperature processes and ambient systems, ensuring the core performance and operational safety of high-temperature equipment.

Key Features:

  • Unparalleled High-Temperature Structural Stability and Insulation – Maintains excellent mechanical strength and geometric shape stability even under long-term exposure to temperatures exceeding 1600°C, effectively resisting softening and deformation at high heat. Concurrently, its superior high-temperature insulation properties safely isolate high voltage, preventing electrical breakdown in hot environments, making it suitable for insulation scenarios directly embedded in high-temperature electro-thermal settings.

  • Excellent Thermal Management and Environmental Barrier Capability – The material's inherently low thermal conductivity makes it an excellent thermal insulator, effectively reducing heat loss or protecting sensitive components from thermal radiation. Its dense microstructure and high tolerance to various corrosive gases, molten salts, and metal melts provide a pure, inert barrier for high-temperature chemical reactions or processing.

  • High-Reliability Design and Long Service Life – Through optimized material formulation and precision manufacturing processes, the products possess good resistance to thermal shock fatigue, capable of withstanding frequent heating and cooling cycles during production. The high hardness and wear resistance ensure a long service life under load-bearing, sliding, or friction conditions, significantly reducing equipment maintenance frequency and operational costs.

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