Product Name: Aluminum Nitride Pressure Ring - Aluminum Nitride Cover Ring
Product Material: High-Purity Aluminum Nitride Ceramic (AlN ≥99.9%)
Material Characteristics:
Application Fields:
Semiconductor manufacturing, Plasma etching equipment, High-power electronics, Vacuum systems
Application Industries:
Wafer fabrication, Power module assembly, Aerospace components, Research instrumentation
Processing Difficulties:
Precise ring circularity control, Thin-wall structure integrity maintenance, High-density sintering without deformation, Surface finish achievement (Ra ≤0.4 μm), Dimensional accuracy preservation during thermal processing, Micro-crack prevention in brittle material
Processing Flow:
Powder preparation → Forming (dry pressing/isotactic pressing) → High-temperature sintering → CNC precision grinding → Surface polishing → Quality inspection → Ultrasonic cleaning → Packaging
Delivery Period:
30–40 days (customizable based on complexity)
The Aluminum Nitride Pressure Ring and Cover Ring are precision-engineered components designed for extreme environments in semiconductor and high-tech industries. Manufactured from high-purity aluminum nitride ceramic, these rings provide exceptional thermal management and electrical insulation while maintaining structural stability under high temperatures, plasma exposure, and corrosive conditions. The combination of tailored geometry and superior material properties ensures reliable performance in critical sealing, spacing, and protection applications.
Key Features:
Excellent Thermal Management：High thermal conductivity (170–220 W/m·K) enables efficient heat dissipation from sensitive components .
Reliable High-Temperature Performance：Stable operation at temperatures up to 1800°C with minimal thermal expansion .
Superior Electrical Insulation：High dielectric strength and volume resistivity ensure safety in high-voltage applications .
Precision Dimensional Control：Tight tolerances and consistent geometry for exacting assembly requirements.
Exceptional Environmental Resistance：Resists plasma erosion, chemical corrosion, and thermal cycling degradation .
