Product Name: Beryllium Oxide Substrate
Material: High-Purity Beryllium Oxide (BeO)
Material Characteristics: High thermal conductivity, excellent electrical insulation, smooth surface finish, dimensional stability
Application Fields: Power semiconductor packaging, RF/microwave circuits, LED heat sinks, high-frequency applications
Application Industries: Semiconductor, telecommunications, power electronics, automotive
Processing Challenges: Maintaining surface flatness, preventing contamination, handling toxicity
Processing Flow: Powder preparation → Tape casting → High-temperature sintering → Surface grinding → Metallization → Quality inspection
Delivery Time: 40-55 days for standard substrates, 60-80 days for customized specifications
Beryllium Oxide Substrates are advanced ceramic substrates engineered for applications demanding both efficient heat dissipation and reliable electrical insulation. Fabricated from high-purity beryllium oxide, these substrates provide exceptional thermal management capabilities for high-power density electronic devices, surpassing conventional substrate materials in thermal performance.
Key Features:
High Thermal Conductivity - Thermal conductivity of 250-330 W/m·K enables efficient heat transfer from high-power semiconductor devices
Excellent Dielectric Properties - Volume resistivity >10¹⁴ Ω·cm and low dielectric loss ensure reliable performance in high-frequency applications
Superior Surface Quality - Achieves surface roughness Ra < 0.1 μm, ensuring optimal performance for thin-film and thick-film circuits
Good Mechanical Properties - High flexural strength and Young's modulus provide structural stability for demanding applications
