Product Name: Processing of Large-Diameter Aluminum Nitride Sheet
Product Material: High-Purity AlN Ceramic (≥99.9%)
Material Characteristics: High thermal conductivity, excellent electrical insulation, high temperature resistance, low thermal expansion, good plasma resistance
Application Fields: Semiconductor equipment, High-power electronics
Application Industries: Wafer processing, Power modules, Laser systems
Processing Difficulties: Warpage control, Thin-wall machining, Surface finishing, Dimensional precision
Processing Flow: Powder → Tape casting → Sintering → CNC machining → Inspection → Cleaning
Delivery Period: 35-45 days
Key Features:
High Thermal Conductivity：170-220 W/m·K for efficient heat dissipation
Excellent Electrical Insulation：Withstands high voltage environments
High Temperature Resistance：Stable performance up to 2200°C
Precision Dimensional Control：Maintains tight tolerances in large sheets
Plasma Erosion Resistance：Suitable for semiconductor processing
