Product Name: Semiconductor Alumina Ceramic Structural Parts
Product Material: High-Purity Alumina Ceramic (Al₂O₃ ≥99.6%)
Material Characteristics:Excellent electrical insulation,High thermal conductivity (20-30W/m-K),Outstanding mechanical strength,High temperature resistance,Superior corrosion resistance
Application Fields:
Semiconductor manufacturing, Chip packaging and testing
Application Industries:
Wafer handling systems, Vacuum chucks, Probe stations
Processing Difficulties:
Micro-hole processing (aperture ≥0.1mm)
Thin-wall structure anti-deformation
High-precision dimensional control (±0.005mm)
Processing Flow:
Powder processing → Forming → Sintering → Precision machining → Inspection → Cleaning
Delivery Period:
30-35 days (depending on complexity)
Key Features:
Ultra-Precision Machining: Capable of stable processing of micro-holes with diameter ≥0.1mm, hole position accuracy controlled within ±0.005mm, with aspect ratio up to 10:1, suitable for precision positioning and airflow channels.
Excellent Thermal Stability: Low coefficient of thermal expansion (approximately 7.2×10⁻⁶/°C), ensuring exceptional dimensional stability under rapid temperature changes.
Outstanding Mechanical Properties: High hardness (≥1600 HV) and high flexural strength (≥350 MPa), ensuring long-term stable operation under high-speed motion and stress.
Reliable Electrical Insulation: Dielectric strength ≥18 kV/mm, high volume resistivity (≥10¹⁴ Ω·cm), effectively ensuring safe operation of semiconductor equipment under high voltage conditions.
High Surface Quality and Cleanliness: Through precision grinding and polishing, surface roughness reaches Ra ≤0.2μm, with strict ultrasonic cleaning and clean packaging meeting the dust-free requirements of the semiconductor industry.
